Do you have a flip-chip challenge ?

posted Aug 26, 2010, 11:31 PM by Jay Singh   [ updated Aug 27, 2010, 12:01 AM ]
We have gone through most of these challenges in bottom up, top down and combination of both. We are committed to simplify chip to package synchronization, bump inventory maintenance, bump routability and bump route quality analysis. There are methodology solutions and automation which could help 

We need your help to identify any flip-chip or packaging challenge that's becoming a hurdle in the way to producing  successful chips.

Let us know by email ( Flip Chip Challenge ), if you have one. Mutual NDA is not a problem.